kw.\*:("BROCHE ELECTRIQUE")
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AUTOMATISATION DU PROCEDE DE SERTISSAGE DES BROCHES DES MODULES.BREUIL G.1975; MEC. MATER. ELECTR.; FR.; DA. 1975; NO 303; PP. 23-27Article
DETERMINING THE COST EFFECTIVENESS OF IC PLUGGABLE, WIRE WRAPPABLE CIRCUIT BOARDSSCHWARTZ WB.1980; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1980; VOL. 26; NO 12; PP. 23-25; BIBL. 2 REF.Article
ANALYSIS OF AN INTERFERENCE-FIT PIN CONNECTIONGOEL RP.1978; I.E.E.E. TRANS. COMPON. HYBRIDS MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 3; PP. 248-251; BIBL. 3 REF.Article
FAST LOGIC NO PROBLEM FOR WIRE-WRAPPED BOARDSGROSSMAN M.1978; ELECTRON. DESIGN; USA; DA. 1978; VOL. 26; NO 25; PP. 34-36; (2 P.)Article
DAS GATTER/PIN-VERHAELTNIS VON LOGIKKOMPLEXEN. = RAPPORT ENTRE LE NOMBRE DE BROCHES ET DE PORTES DANS LES CIRCUITS LOGIQUES COMPLEXESBRACKELMANN W.1976; ELEKTRON. RECHENANLAGEN; DTSCH.; DA. 1976; VOL. 18; NO 1; PP. 22-26; BIBL. 8 REF.Article
SCREENING PROCEDURE FOR ADHESION DEGRADATION DUE TO SOLDER LEACHING IN THICK-FILM HYBRID MICROCIRCUITS.LEVEN SS.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 3; PP. 39-44; BIBL. 7 REF.Article